Product Properties
Sn42Bi58 nanopowder/nanoparticles (nm & um)
Size | Type | Particle size（nm） | Purity（%） | Specific surface area（m2/g） | Bulk density（g/cm3） | Polymorphs | Color |
nm | JB-Sn42Bi58 | 40 | 99.9 | 13.48 | 0.64 | spherical | black |
| sub um | JB-Sn42Bi58-02 | 500 | 99.5 | 1.247 | 1.56 | spherical | black |
Custom | Acccording to customers requirments to adjust ratio. | ||||||
Sn42Bi58 Nanopowder Features
The eutectic composition of Sn42Bi58 has a melting point of approximately 138°C (280°F), which is significantly lower than that of many other solder materials. This low melting point is advantageous for applications requiring low-temperature processing, reducing the risk of thermal damage to temperature-sensitive components.Components joined using Sn42Bi58 nanopowder experience less thermal stress during soldering due to the alloy’s low melting point. As with other nanopowders, Sn42Bi58 nanoparticles have a high surface area-to-volume ratio. This feature enhances the material’s reactivity and provides improved wetting properties, which can lead to stronger, more reliable solder joints with better mechanical and electrical connections.Given the environmental and health concerns associated with lead-based solders, Sn42Bi58 serves as an attractive lead-free alternative.
Sn42Bi58 Nanopowder Applications
Flexible Electronics: The flexibility and low processing temperatures of Sn42Bi58 make it suitable for use in flexible electronics. These devices often incorporate delicate materials that can be degraded by high-temperature processes.
Thermal Interface Materials: Sn42Bi58 nanopowder can be used in the formulation of thermal interface materials (TIMs) for electronics cooling. The low melting point allows for a lower processing temperature, and the nanopowder form can enhance the thermal conductivity by increasing the contact area at the interface, improving heat dissipation from electronic components to heat sinks.
3D Printing: The low melting point and ease of processing make Sn42Bi58 nanopowder a candidate for additive manufacturing (3D printing) applications, particularly for printing conductive tracks and components. Its ability to be sintered at relatively low temperatures can enable the integration of electronic functionalities directly into 3D-printed parts.
Conductive Inks and Pastes: Sn42Bi58 nanopowder can be suspended in solvents to create conductive inks and pastes for printed electronics. These materials can be used to draw conductive paths on various substrates, including paper, textiles, and plastics, enabling the production of electronic circuits without the need for traditional etching processes.