Product Properties
Copper Tungsten (W-Cu) Alloy nanopowder/nanoparticles (nm & um)
Size | Type | Particle size（nm） | Purity（%） | Specific surface area（m2/g） | Bulk density（g/cm3） | Polymorphs | Color |
nm | JB-W-Cu | 70 | >99.9 | 8.08 | 0.26 | spherical | black |
Custom | Acccording to customers requirment to adjust ratio | ||||||
Copper Tungsten (W-Cu) Alloy Nanopowder Main Feature
Thanks to the copper component, the alloy exhibits excellent electrical and thermal conductivity, making it suitable for applications requiring efficient heat dissipation and electrical transmission, such as electrical contacts and heat sinks.The tungsten component contributes to the alloy’s high melting point and thermal stability, allowing the material to maintain its integrity and performance in high-temperature environments. This is critical for applications in welding, aerospace, and power generation sectors.Copper tungsten alloy is highly resistant to wear and arc erosion, which is essential for electrical contacts and switching devices subjected to arcing and mechanical wear. This resistance ensures longevity and reliability in harsh operating conditions.The alloy has a relatively low coefficient of thermal expansion, a property derived mainly from its tungsten content. This makes it ideal for applications where dimensional stability under varying temperatures is crucial, such as in precision instruments and aerospace components.
Copper Tungsten (W-Cu) Alloy Nanopowder Applications
Electrical Contacts and Electrodes:The excellent electrical and thermal conductivity of copper, combined with the high melting point and wear resistance of tungsten, makes this alloy ideal for use in electrical contacts, electrodes, and other components subjected to high temperatures and arcing. These applications are common in the electrical, automotive, and aerospace industries, where reliability and durability under high stress are critical.
Heat Sinks and Thermal Management: Copper tungsten alloy’s high thermal conductivity and stability are advantageous for heat sinks and thermal management systems in electronics and semiconductor devices. It effectively dissipates heat from critical components, maintaining optimal operating temperatures and improving device longevity and performance.
Medical Device Components: In medical devices, especially those requiring precision and durability under high temperatures, copper tungsten alloys are used for components that need to maintain stability and performance during sterilization processes and in high-use environments.
Vacuum Components and X-ray Targets: Copper tungsten‘s high melting point and thermal conductivity are ideal for components in vacuum environments and X-ray targets in medical imaging equipment. The alloy can withstand the high-temperature conditions and thermal cycling encountered in these applications without degrading.